Hot Solder Dip

Technical Plating is one of a select few companies in the United States to perform Hot Solder Dip. Hot Solder Dip is the process of immersing a part into a bath of a molten 60/40-tin/lead alloy at a temperature greater than at 370°F. The coating that's produced consists of a very thin intermetallic layer that first forms at the interface of the base material and the tin, followed by a layer of pure solder. Advantages of Hot Solder Dip is excellent solderability, and excellent wear and corrosion resistance. TPI is able to do Hot Solder Dip as a rack process.

Specifications:

  • ASTM A1074-11
  • Custom Specifications

*as this process differs from standard plating processes, TPI will usually require samples prior to quoting to determine appropriate pricing and tooling charges.

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